发明名称 METHOD FOR CLOSELY BONDING OVERLAY FILM TO INJECTION MOLD AND OVERLAY INJECTION MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To closely bond an overlay film to a decorative mold without wrinkling the same when the overlay film to be closely bonded to the decorative mold among the decorative mold and an injection mold is heated and softened to be drawn under vacuum. SOLUTION: After a required amt. of slightly compressed air is supplied in such a state that the peripheral edge part of an overlay film F is fixed to a decorative mold 2A, (2B) by a film clamp 10, the film F is heated and softened to suck the air in the mold. By this constitution, the film F is almost parallelly held without being slackened to be uniformly heated as a whole by a heater 12. When the film F is heated and softened, it overcomes the pressure of internal air to be expanded upwardly to be preliminarily stretched. When the internal air is sucked herein, the overlay film is almost uniformly deformed to become hard to wrinkle. Since the deformation quantity of the film is small by preliminarily stretched quantity, the film F further becomes hard to wrinkle and is cleanly closely bonded to the inner surface of the decorative mold 2A, (2B).
申请公布号 JPH10225956(A) 申请公布日期 1998.08.25
申请号 JP19970029419 申请日期 1997.02.13
申请人 TRINITY IND CORP 发明人 SAKABE ATSUSHI;SOGAWA TOORU;KUCHIDA KAZUNARI
分类号 B29C33/18;B29C45/06;B29C45/12;B29C45/14;B29C45/34;B29K105/12;B29L9/00;(IPC1-7):B29C45/14 主分类号 B29C33/18
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