发明名称 ELECTRONIC EQUIPMENT CASE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To promote enhancement of frame grounding by a method wherein a boss with a flat on its side is formed on the inner surface of a case, and a shielding material is continuously transferred onto the upside and flat of the boss. SOLUTION: An electronic equipment case structure is equipped with a sheet or foil-like shielding material 1 which is formed of conductive material and transferred onto the inner surface of a resin case 2 so as to prevent electromagnetic waves from leaking out of or penetrating into the case 2. At this point, a boss 4 with a flat 3 on its side is formed on the inner surface of the case 2, and a shielding material 1 is continuously transferred onto the upside 5 and flat 3 of the boss 4 to form a shielding structure. For instance, the flat 3 is formed of a single plane, the shielding material 1 is continuously transferred onto the flat 3 and upside 5 of the boss 4 from a certain direction. Or, the flat 3 is formed of two or more planes, and the shielding material 1 is continuously transferred onto the flat 3 and upside 5 from two or more directions.
申请公布号 JPH10229290(A) 申请公布日期 1998.08.25
申请号 JP19970030823 申请日期 1997.02.14
申请人 PFU LTD 发明人 SHUKUTANI TOSHIRO
分类号 H05K5/00;B29C45/16;B29K105/22;B29K705/02;B29K705/10;B29L31/34;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K5/00
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