| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which can be molded into a product reduced in void formation, improved in soldering crack resistance and can give a sealed semiconductor device having excellent reliability by using an epoxy resin, a phenolic resin curing agent, a cure accelerator, an inorganic filler and a silicone oil as the essential components. SOLUTION: The epoxy resin herein mentioned means collectively an epoxy- containing monomer, oligomer or polymer and the phenolic resin herein mentioned means collectively a phenolic-hydroxyl-containing monomer, oligomer or polymer. The cure accelerator herein mentioned means one that promotes the reaction of the epoxy resin with the phenolic hydroxyl group and is used in a sealing material. The inorganic filler used is a silica powder (e.g. spherical fused silica powder) excellent in flowability, etc. The silicone oil used is one having alkoxylane groups, alkoxyl groups and polyether groups is at least one member selected among compounds of the formula I [wherein A is formula II (wherein 1<=x<=3), -OCH3 , -OC2 H5 ; B is formula III; and R<1> is a 1-30C alkylene or the like], etc. |
