发明名称 Method of forming raised source/drain regions in an integrated circuit
摘要 A method is provided for forming a planar transistor of a semiconductor integrated circuit, and an integrated circuit formed according to the same. A transistor encapsulated in a dielectric is formed over a substrate. First source and drain regions are formed in the substrate adjacent the transistor. Conductive raised second source and drain regions are formed which overly exposed portions of the first substrate source and drain regions adjacent the transistor. The raised second source and drain regions are formed such that an upper surface of the raised second source and drain regions are substantially planar with an upper surface of the transistor. The dielectric encapsulating the transistor electrically isolates the transistor from the raised second source and drain regions.
申请公布号 US5798278(A) 申请公布日期 1998.08.25
申请号 US19960681065 申请日期 1996.07.22
申请人 SGS-THOMSON MICROELECTRONICS, INC. 发明人 CHAN, TSIU CHIU;SMITH, GREGORY C.
分类号 H01L21/28;H01L21/285;H01L21/336;H01L29/08;H01L29/417;H01L29/45;H01L29/78;(IPC1-7):H01L21/265;H01L29/76 主分类号 H01L21/28
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