发明名称 Semiconductor device having an isolation layer and two passivation layers with edges that are not aligned with each other
摘要 The invention relates to a semiconductor device with a substrate, with at least one isolation layer with at least one window, with a passivation layer scheme lying on the isolation layer and a metallization lying on the passivation layer scheme, the latter comprising at least two dielectric layers of which the first dielectric layer covers the isolation layer with its edges as well as the substrate in an outer edge zone of the window, and of which the second dielectric layer covers the first dielectric layer also over the edge of the isolation layer and in a portion of the outer region of the window.
申请公布号 US5798562(A) 申请公布日期 1998.08.25
申请号 US19960738513 申请日期 1996.10.28
申请人 U.S. PHILIPS CORPORATION 发明人 RABOVSKY, JOHANNES;SIEVERS, BERND
分类号 H01L29/73;H01L21/316;H01L21/331;H01L23/31;H01L29/06;H01L29/732;(IPC1-7):H01L23/58;H01L29/00 主分类号 H01L29/73
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