| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to prevent occurrence of a soldering failure in outer leads while the width of the pitch between the outer leads is maintained to a reduction in the area of a package, by a method wherein the resin-sealed plane shape of the package is formed into a diamond shape. SOLUTION: A semiconductor device 11 is constituted into a structure, wherein a semiconductor pellet 13 is sealed with an epoxy resin which is used as a package body 12, and the visual appearance of the device 11 is one of the shape of a dual inline package having leads 14, which are used as external electrodes, in two directions. The leads 14 are formed so as to extend vertically to the surface of a resin sealing material on the body 12 and the plate width of inner leads 14a is formed narrow on the side of the pellet 13. The plane shape of the body 12 is formed into a diamond shape, and when the acute angle of the diamond shape is assumed 45 deg., for example, 71% of a reduction becomes possible in the same perimeter as that of a square. Accordingly, as the length of the sides of the diamond shape becomes long as compared with the same area as that of the square, solder bridges in outer leads can be eliminated.</p> |
