| 摘要 |
PROBLEM TO BE SOLVED: To protect a formed gold film against damage such as marks or stained attached to it in a shaping process, by a method wherein the surface of a conductor circuit formed on the surface of a board is plated with gold, the gold film is covered with a protective metal film, then the board is subjected to a shaping process, and the protective metal film is removed. SOLUTION: A copper circuit 4 is formed on the surface of a multilayered board 1, and a nickel film 5, a gold film 6, a copper film 7, and a solder film 8 are successively formed on the copper circuit 4. These metal films are not, limited in a forming method, for instance they can be formed through an electroplating method. The copper film 7 and the solder film 8 formed on the gold film 6 are made to serve as protective metal films. Then, the board is processed into a certain shape prescribed in dimensions undergoing a shaping process. The solder film 8 and the copper film 7 serving as protecting metal films are removed so as to make the gold film 6 exposed. The solder film 8 and the copper film 7 are not limited in a removal method, and they can be removed, for instance, with etchant or solder releasing liquid. |
