| 摘要 |
PROBLEM TO BE SOLVED: To dissolve catalysts attached to a non-conductive layer at the same time when etching is carried cut so as to improve circuits in insulation reliability between them by a method wherein a specially compounded catalytic solution which contains, at least, one salt selected out of silver salt and copper salt is used as a catalytic solution for electroless plating. SOLUTION: A method of manufacturing a printed wiring board comprises processes where electroless plating catalysts are applied onto the surface of a non-conductive body, electroless plating is carried out, electrolytic copper plating is carried out, and then a circuit is formed by etching. A water solution which contains at least one metal salt selected out of silver salt and copper salt, negative ion surface-active agent, and a reducing agent is used as a catalytic solution used for applying electroless plating catalyst. Silver salt such as silver nitrate is used, and copper salt such as copper sulfate is used. It is preferable that polyoxyethylene lauryl ether sodium sulfate is used as negative ion surface-active agent, and hydrogenated boron sodium is used as a reducing agent. |
