发明名称 INTERCONNECTION DEVICE OF ELECTRONIC COMPONENT PART
摘要 <p>PROBLEM TO BE SOLVED: To enable a comparatively large current to flow through a monolithic multilayered device by a method wherein insulating material and conductive material are alternately, thermally sprayed through a mask to form insulating layers and conductor layers alternately laminated on a board, and the sprayed conductor layers are metallurgically joined together to make an interlayer electrical connection. SOLUTION: Thermal spray 15 is sprayed through various masks possessed of various patterns as controlled, whereby insulating layers and conductor layers are alternately attached or deposited to form an interconnection device composed of conductor traces, interlayer conductor vias, and insulating isolation layers which isolate trace planes from each other respectively. The masks are composed of positive masks 17 for forming conductor traces of positive image in a structure which comprises conductor layers and negative masks which shut off thermal sprays for forming vias, bonding pads, and test points on insulating layers. Various conductor layers formed of sprayed conductive material are metallurgically joined together for the formation of a multilayered device.</p>
申请公布号 JPH10229282(A) 申请公布日期 1998.08.25
申请号 JP19970212299 申请日期 1997.08.06
申请人 FORD MOTOR CO 发明人 KLASSEN DAVID JOHN;WHITNEY MORGAN MERRITT JR;PETERMAN THOMAS RANDALL;PERGANDE PAUL EARL;COLLINS DAVID ROBERT
分类号 C23C4/00;C23C4/02;H05K3/14;H05K3/46;(IPC1-7):H05K3/46 主分类号 C23C4/00
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