MANUFACTURE OF CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To connect a substrate electrode accurately with a device electrode. SOLUTION: A board electrode 2 can be aligned easily with the bump 6 and electrode 5 of an electronic device 1 by inserting the bump 6 and electrode 5 into electrode exposing holes 3a made in an adhesive layer 3. Since the electronic device 4 mounted on a board 1 is secured to the board 1 through adhesion of the adhesive layer 3, positional shift of the electronic device 4 from the board 1 can be prevented surely after alignment and the board electrode 2 can be connected accurately with the bump 6. When the electrode exposing holes 3a are made in the adhesive layer 3 utilizing a laser light LB for connection, any special line for forming the electrode exposing holes 3a is required and the manufacturing process is simplified thus reducing the manufacturing cost.