| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for laying up a multilayer printed wiring board such that the primary laminated board is molded while keeping the quality at the time of lamination molding. SOLUTION: A primary laminated board 1, where prepreg 3 and inner layer plate 5 are laminated alternately, is hot-pressed by induction heating. Electrode rods 7 are arranged above and below the primary laminated board 1 such that the prepreg 3 is fused and bonded by heating the electrode rods 7. A copper foil part is bonded to the circumferential fringe part of the inner layer plate 5 and provided with a plurality of copper toil missing parts. The electrode rods 7 are arranged oppositely to the copper foil missing parts. The prepreg 3 begins to be fused when it is heated up to about 70 deg.C and begins to be hardened at about 170 deg.C and bonded to the inner layer plate 5. |
