| 摘要 |
PROBLEM TO BE SOLVED: To effectively suppress permeation of moisture through the bottom face of a package while minimizing increase in the thickness of package itself by forming a moisture permeation preventive film composed of diamond-like carbon having extremely low moisture permeability on the outer surface of the package body including at least the bottom face thereof. SOLUTION: A recess 2 for receiving an element is made integrally in a package body 1 made of resin and a semiconductor chip element 3 is boded through die bonding material to the bottom face of the recess 2. Furthermore, a moisture permeation preventive film 8 composed of diamond-like carbon is formed on the bottom face of the package body 1. According to the structure, permeation of moisture through the bottom face of package can be suppressed effectively and moisture resistance of a plastic package can be enhanced significantly. When the semiconductor element 3 is a solid state image sensor and a cover 7 is composed of seal glass, deterioration of image due to dew formation can be prevented after long term preservation. |
