发明名称 APPARATUS AND METHOD FOR SEALING SEMICONDUCTOR DEVICE WITH RESIN
摘要 PROBLEM TO BE SOLVED: To block a heat sink from shifting up even when the fluid pressure of a seal resin is applied at filling of the resin, by providing a first and a second lower dies and fixing the heat sink to the dies through a heat sink adhesion part provided at the first lower die. SOLUTION: A lower die is divided into a first and a second lower dies 19-1, 19-2; the first die has a high-heat resistance rubber-made heat sink adhesion part 18 at the upper layer and the second die surrounds it. A heat sink 16 at the lower dies is disposed at the adhesion part 18, thereby fixing the heat sink to the first lower die 19-1. If the fluid pressure of a seal resin is applied to the heat sink 16 at filling of the resin, this blocks the heat sink from shifting up. The exposed part of the heat sink 16 is tightly adhered to the adhesion part 18 of the first lower die, and hence this prevents unwanted resin burrs from growing at the surface of the heat sink during the resin sealing.
申请公布号 JPH10223669(A) 申请公布日期 1998.08.21
申请号 JP19970027426 申请日期 1997.02.12
申请人 OKI ELECTRIC IND CO LTD 发明人 ANDO SEIJI;TERUI MAKOTO
分类号 H01L23/28;H01L21/56;H01L23/50;(IPC1-7):H01L21/56 主分类号 H01L23/28
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