发明名称 TEMPERATURE COMPENSATING CIRCUIT
摘要 PROBLEM TO BE SOLVED: To enable the enlargement of range of temperature compensation by impressing a biased current current-controlled by the resistance value of a semiconductor temperature transducer on the diode of a voltage dividing circuit of the output of a buffer circuit to which signal conditioner output. SOLUTION: When an input signal 100e is buffered by a buffer circuit 9 and impressed on a resistance 10, an output signal 101e becomes a signal obtained by voltage-dividing the input signal 100e at a voltage-dividing circuit 50. The flow of a biased current which is impressed on a diode 12 from a power source 13 is prevented by a capacity 11. The biased current from the power source 13 changes due to changes in temperature, the resistance value of the diode 12 changes, and the attenuation of a circuit changes to perform temperature compensation. The power source 13 comprises a semiconductor temperature transducer such as a thermistor inside, and by its changes in resistance, an output current value changes exponentially. By this, the biased current is impressed on the diode 12, and the amount of transfer for the whole of the circuit changes linearly by temperature. By this method, it is possible to enlarge the range of temperature which can be compensated.
申请公布号 JPH10221385(A) 申请公布日期 1998.08.21
申请号 JP19970022270 申请日期 1997.02.05
申请人 YOKOGAWA ELECTRIC CORP 发明人 NAGANUMA HIDEKI
分类号 G01K7/24;G01R19/32;H03F1/30;(IPC1-7):G01R19/32 主分类号 G01K7/24
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