摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor and a method for manufacturing the same which can improve the sensor sensitivity without enlarging the chip size. SOLUTION: An overlapping part 1a and a support part 1c supporting the overlapping part 1a through a flexible part 1b are formed by etching a silicon wafer 1. An overlapping part 2a is spliced to the overlapping part 1a through a silicon oxide film 5, and a support part 2b is spliced to the overlapping part 1a through the silicon oxide film 5. Also, the flexible part 1b is formed with a sensor part 3 formed with a wiring resistance part 4 to be electrically connected thereto, and an electrode pad 7 is formed to be electrically connected to the wiring resistance part 4. Also, a lower part stopper 8 is junctioned to the lower part of a silicon wafer 2 and an upper part stopper 10 is junctioned to a silicon nitride film 6 through a junction electrode 9. Here, the upper part stopper 10 is formed with a recess 10a so that the overlapping parts 1a, 2a can vertically vibrate. Also, the lower part stopper 8 is spaced by a desired distance from the overlapping part 2a.</p> |