| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball grid array package structure which is enhanced in reliability of soldered connection by keeping all reflow soldered part nearly uniform in temperature by heating so as not to leave an unmelted part of solder and a method of mounting a ball grid array package on a printed circuit board. SOLUTION: Solder balls are provided in a matrix onto the rear side of a ball grid array package 1, through-holes 8 are bored in the package 1, and the heat of reflow solder is circulated between the package 1 and a printed circuit board 10 taking advantage of the through-holes 8 when a reflow soldering process is carried out, whereby a temperature between the package 1 and the printed circuit board 10 is set uniform. |
