| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire ball growing method with which the balls of the desired size can be grown in a stable manner on the tip of a wire without controlling the voltage and the current, etc., to be applied from the source of high voltage, and to provide a wire bonding device. SOLUTION: This wire bonding device is provided with a tool 1 from which a bonding wire 3 is fed, a torch rods 2 which are arranged facing to the tip part of the wire 3 fed from the stool 1, a high voltage source with which a ball 4 is grown on the tip part of the wire 3 by discharging electricity by the application of high voltage between the tip part of the wire 3, which is connected to the torch rod 2, and the torch rod 2 and a motor with which the tool 1 and a wire clamper 11 are vertically moved. The tool 1 and the wire clamper 11 are moved down by the motor in such a manner that the distance between the tip part of the wire 3 and the torch rod 2 can be maintained almost constantly in accordance with the degree of growth of the ball 4 at the tip part of the wire 3. |
