DEVICE AND METHOD FOR TREATING WAFER AND MANUFACTURE OF SOI WAFER,申请号JP19970021796-传众专利搜索

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发明名称	DEVICE AND METHOD FOR TREATING WAFER AND MANUFACTURE OF SOI WAFER
摘要
申请公布号	JPH10223585(A)	申请公布日期	1998.08.21
申请号	JP19970021796	申请日期	1997.02.04
申请人	CANON INC	发明人	SAKAGUCHI KIYOBUMI
分类号	H01L21/00;H01L21/02;H01L21/20;H01L21/304;H01L21/306;H01L21/311;H01L27/12;(IPC1-7):H01L21/304	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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