发明名称 METHOD AND SYSTEM FOR REMOVING THIN FILM AND WORK
摘要 <p>PROBLEM TO BE SOLVED: To decrease the number of steps by irradiating a plurality of thin films sequentially on order of formation thereof with lights of such wavelength as to be absorbed respectively. SOLUTION: Thin films 12, 13 and 14 formed on a substrate 11 are irradiated sequentially, starting from the one farthest from the substrate 11, with laser lights of such wavelength as to be absorbed efficiently by respective thin films thus removing the thin films 12, 13 and 14 at least partially. More specifically, the thin films 14, 13 and 12 are irradiated sequentially with laser lights L3 , L2 and L1 to be absorbed efficiently. According to the method, irradiated parts 14a, 13a and 12a of desired shape can be removed easily by small number of steps and a work can be processed in a short time.</p>
申请公布号 JPH10223504(A) 申请公布日期 1998.08.21
申请号 JP19970021458 申请日期 1997.02.04
申请人 NIKON CORP 发明人 HIURA MITSURU;IWAMOTO JOJI
分类号 G03F7/36;B23K26/00;G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/36
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