| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device at low cost. SOLUTION: Inner leads 3 are formed on the base resin 2 where a device hole 12 and a bent hole 13 are formed in steps (a) and (b), insulating resin is applied, an outer electrode pad 5 is formed by perforating an aperture on the insulating resin 4, elastic resin 6 is applied on a bent part 1d of the inner leads 3, and a package film 1 is formed. Then, inner lead forming surface 1A is turned on the side of an LSI chip 8, the inner leads 3 are collectively bonded on a chip electrode pad 8a by thermo-press welding, and an LSI chip 8 is fixedly mounted on a device mounting film part 1b using sealing resin 9 in step (c). Then, the outer connection film part 1c of the package film 1 is bent at 180 deg. and it is fixed to the device mounting film part 1b using a bonding agent 10 in step (d).
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