| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable resin sealed semiconductor device on which the height of a wiring can be made low, the slipping of wire and a non- filling part of fillers are eliminated when a molding operation is conducted. SOLUTION: A semiconductor chip 32 is die-bonded on a substrate 31 where a wiring pattern 33 is formed, liquid resin 35 is applied to the circumferential part only of the semiconductor chip 32, and the resin is hardened by heating. Then, lines of conductive paste 34 are drawn on the hardened resin 35 using a dispenser, etc., and the pad of the semiconductor chip 32 and the wiring pattern 33 are connected. Lastly, the whole body is sealed by liquid resin 35. |
