发明名称 DEVICE AND METHOD FOR WIRE BONDING
摘要 PROBLEM TO BE SOLVED: To make it possible to select the wiring combination corresponding to the different type of chips which are continuously conveyed. SOLUTION: In this wire bonding method, the combination of wiring in accordance with the type of a chip 20 is stored in a memory storage 4, and the type of the chip 20 on a lead frame 10 to be conveyed is recognized by the image obtained by a camera 2. The wiring position of a bonding wire W is controlled by a control part 5, by selecting the wiring combination corresponding to the above-mentioned recognized type.
申请公布号 JPH10223677(A) 申请公布日期 1998.08.21
申请号 JP19970028590 申请日期 1997.02.13
申请人 MIYAZAKI OKI ELECTRIC CO LTD;OKI ELECTRIC IND CO LTD 发明人 ARAGAKI TAKESHI
分类号 H01L21/60 主分类号 H01L21/60
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