| 摘要 |
<p>PROBLEM TO BE SOLVED: To raise the reliability of a semiconductor device of a structure, wherein the production efficiency of the device can be enhanced and at the same time, the exposed parts of a lead part and the like can be accurately sealed, the generation of a chipping can be prevented and so on. SOLUTION: A semiconductor device is provided with a semiconductor chip 10, an insulating material 20 bonded to the side of the formation surface 10a of an electrode terminal 12 on the chip 10, a wiring pattern 30, which is formed on a land part 32, which has the one end side provided on the member 20 and is connected with the side of an external connection terminal, and is formed on a lead part 34 which has the other end side connected with the terminal 12, and a resin sealing part 50, which is fed and cured and is provided in the gap between the formation surface 10a of the electrode 12 and a cover member 52, which covers the upper part of the formation surface 10a of the terminal 12 and the upper part of the lead part 34 and at the same time, has the external shape formed larger than the chip 10 so as to cover the vicinity of the outer edge of the chip 10, and seals the formation surface 10a of the terminal 12, the lead part 34 and the side surface of the chip 10.</p> |
