| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure, which makes it possible to easily inspect the electrical characteristics of a semiconductor device and at the same time, has the roughly same size as the external shape of the semiconductor device. SOLUTION: A mounting structure of a semiconductor device comprises the semiconductor device 10, a connection substrate 30 arranged under the lower part of this device 10 and a lead 20, which has the one end connected with an external connection terminal 12 under the device 10 and has the other end provided on the substrate 30 with the lead 20 folded back. The substrate 30 is constituted of a plurality of carrier substrates. Each of the plurality of the carrier substrates shows the shape of a rectangular equilateral triangle and is formed into a roughly quadrangular shape under the low part of the device 10.</p> |
