REDUCING METHOD OF PARTICLES ON SUBSTRATE USING CHUCK CLEANER

摘要

PROBLEM TO BE SOLVED: To provide the improving method of precision and evenness in the successive processing such as lithographing step, etc., by reducing the particle number on the back of a substrate such as semiconductor wafer. SOLUTION: A semiconductor substrate is arranged on chuck 10 in a track system such as a resist coater, a developing machine or a spin coater in the other type. A substrate processed as usual is removed. Next, a chuck is cleaned up using e.g. EGMEA or PGMEA for feeding a solvent through a feeding nozzle 38 of a system. Otherwise, a brush 36 or sponge partially saturated with the solvent 39 is shifted on the entire surface to remove the particles. The chuck cleaning step can be performed between respective wafers or between respective wafers and lots or otherwise, aperiodically i.e., in every shifting time, or in every time when the cleaning is required due to the particles accumulated on the chuck.