发明名称 TAPE CARRIER PACKAGE, FLEXIBLE SUBSTRATE AND SUBSTRATE MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To enable the alignment using image pickup means, by providing an aligning hole near connection electrodes on a base. SOLUTION: An aligning hole 54 is a hole of about 1mm wide, provided near and outside connection electrodes 52a distant about 0.5mm from an anisotropically conductive film connection. Electrodes 51a are positioned to align with Cu electrodes 33, using a charge transfer device camera for checking the positions of the electrodes 52a and Cu electrodes 33 from the holes 54, thereby ensuring a high accuracy positioning in a directionα. To avoid shorting Cu wirings 52 in the aligning holes 54, they are sealed with a high-insulation resin. The aligning holes 54 enables the high accuracy positioning even when mounting on an opaque substrate such as glass epoxy substrate 30.
申请公布号 JPH10223695(A) 申请公布日期 1998.08.21
申请号 JP19970021666 申请日期 1997.02.04
申请人 TOSHIBA CORP 发明人 YAMAMOTO TETSUYA
分类号 H01L21/60;H05K3/32;H05K3/36;(IPC1-7):H01L21/60 主分类号 H01L21/60
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