| 摘要 |
<p>PROBLEM TO BE SOLVED: To find a correction value for the feeding amount of a blade in a non-contacting state. SOLUTION: A dicing device which dices a wafer with a blade 19 by moving the blade 19 forwards and backwards, while rotating the blade 19 after the blade 19 has been fed to a holding surface 11 of a wafer 1 is provided with a range finder 20, which measures the errorΔA of a present location 11a of the holding surface 11 from a reference location 11o, by measuring the distance to the surface 11 and a CPU 21 which measures an error B or a present location 19b of the point of the blade 19 from a reference location 19o from the feeding amount of the blade 19 until the blade 19 is detected by means of a non- contacting sensor 22. The correction value for the feeding amount of the blade 19 is found, based on the sum of the errorΔA of the present location of the holding surface 11 from the reference location 11o and the errorΔB of the present location of the point of the blade 19 from the reference location 19o. Since the amount cut by the blade 19 into the wafer 1 can be maintained at a set value after the blade 19 has been set by correcting the feeding amount of the blade 19 with the correction value found, a prescribed cutting amount can be maintained.</p> |
