| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress the amount of silicon dust produced, when a semiconductor wafer is diced. SOLUTION: A semiconductor water 1 is diced with a first blade until a relation, A>B>100μm, is established between the thickness of the wafer 1 and the un-diced amount B of the wafer 1. Then, the wafer 1 is divided into individual LSI chips by further dicing the diced spot of the wafer 1 with the first blade with a blade thickness C provided by a second blade 3b with a blade thickness D selected such that a relation, (C-5μm)>=D>30μm, is established between blade thicknesses C and D of the first and second blades.</p> |
