| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board for heat dissipation use, which is provided with an electrical insulating layer, has a good heat dissipation property, the good alignment of a linear expansion coefficient and a good solderability and moreover, is low in production cost, and a method of manufacturing the board. SOLUTION: A board 10 for heat dissipation use is constituted of a heat sink 11 and an insulating board 12. This insulating board 12 is formed of a calcined body of a mixed kneaded material of a silicon carbide(SiC), copper(Cu) and lead(Pb) in a thickness of 2.70mm and Cu layers 13 are respectively formed on the upper and lower surfaces of the board 12 in a thickness of 0.15mm for making good the wettability of the layers 13 with solder layers 14. Moreover, this board 12 is connected with a semiconductor element 21 for power use and the heat sink 11 through the solder layers 14 on its upper and lower parts. Moreover, the heat sink 11 is constituted of a metal plate, such as an aluminium(Al) plate and a copper(Cu) plate.</p> |
