| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable resin sealed type semiconductor device of high migration resisting property in which the pad electrode on a semiconductor chip and the inner lead of a lead frame are connected by a film carrier tape, and to provide the manufacturing method of the above-mentioned semiconductor device. SOLUTION: A semiconductor chip 6 is adhered to the island 7c of a lead frame, and an inner lead 7a of the lead frame and a bump 6a of the semiconductor chip 6 are connected by the lead from an inner lead 4a to an outer lead 4b of a film carrier tape. A semiconductor of the structure having no bonding agent, etc., which is the cause of generating migration is formed by providing the process of removing a bonding agent containing suspender.</p> |
