发明名称 MANUFACTURE OF FERROELECTRIC THIN FILM ELEMENT, FERROELECTRIC THIN FILM ELEMENT AND FERROELECTRIC MEMORY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a ferroelectric thin film element consisting of a compound film of a Bi layer type structure, which enables a reduction in a film-forming temperature, a reduction of time and the simplification of a production process, the ferroelectric thin film element and a ferroelectric memory element. SOLUTION: A method of manufacturing a ferroelectric thin film element of a structure, wherein a lower electrode, a ferroelectric thin film and an upper electrode are provided in order on a substrate, comprises a process (S10) of applying a precursor solution, which contains a metallic element constituting a ferroelectrics, on the surface of the above lower electrode formed on the substrate, a process (S11), wherein the applied presursor solution is heated to remove a solvent only from the solution and to dry the precursor solution, a first heat-treating process (S13), wherein the dried precursor is heated in an atmosphere of a gas pressure lower than one atmospheric pressure to form a ferroelectric thin film, and a second heat-treating process (S15), wherein after the upper electrode is formed on the ferroelectric thin film, the upper electrode is heated in a nitrogen atmosphere.
申请公布号 JPH10223847(A) 申请公布日期 1998.08.21
申请号 JP19970041669 申请日期 1997.02.10
申请人 SHARP CORP 发明人 USHIKUBO MAHO;YOKOYAMA SEIICHI;MATSUNAGA HIRONORI
分类号 H01L21/8247;H01L21/822;H01L21/8242;H01L21/8246;H01L27/04;H01L27/10;H01L27/105;H01L27/108;H01L29/788;H01L29/792 主分类号 H01L21/8247
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