A photocurable resin composition which comprises: (A) a urethane (meth)acrylate oligomer obtained by the reaction of (a) at least one polyol compound preferably selected from the group consisting of polyester polyols and polycarbonate polyols, (b) a polyisocyanate compound, and (c) a hydroxyl group-containing (meth)acrylate compound; (B) a (meth)acrylolylphosphate; (C) a polyfunctional (meth)acrylate compound; and (D) a photopolymerization initiator. The composition exhibits a fast cure speed, and the cured products obtained from the composition exhibit superior adhesion under high temperature-high humidity conditions and metal corrosion properties.
