LAMINATED MULTILAYER SUBSTRATES

摘要

A process of laminating large-layer-count (LLC) substrates (20) includes formation of first and second vias (24) through respective substrates (20). A conductive path (21z, 25, 22, 28) is formed through each of the respective vias (24), and posts (40, 42) are formed on the respective vias (24), electrically connected to the respective conductive path (21z, 25, 22, 28). A non-flowable adhesive layer (46) having an aperture (48) is provided between the LLC substrates (20) so that the posts (40, 42) confront each other through the aperture (48). The LLC substrates (20) are pressed together through the non-flowable adhesive layer (46) to mechanically bond them together, and so that the posts (40, 42) abut each other. Simultaneously, the posts (40, 42) are electrically bonded to each other in the aperture (48).