发明名称 PACKAGING MATERIAL HAVING MOLD RELEASE FUNCTION
摘要 A packaging material which has a mold release function which enables direct packaging of various adhesive articles in a state in which the packaging material can be released from an article. The packaging material has a release function, which enables seal processing providing an adequate seal strength even if a surface being subjected to seal processing when the packaging material is subjected to seal processing is a release agent layer surface. The release agent layer surface usually develops cracks when the packaging material is drawn, and an area rate of cracks per unit surface area of the release agent layer after the packaging material is drawn is 10 to 80 % or an area rate of cracks in a seal processed portion of the packaging material is 10 % or more.
申请公布号 WO9835884(A1) 申请公布日期 1998.08.20
申请号 WO1998JP00604 申请日期 1998.02.13
申请人 NITTO DENKO CORPORATION;ITO, TAKIO;HIRAMATSU, TSUYOSHI;TAKAHASHI, MAKOTO 发明人 ITO, TAKIO;HIRAMATSU, TSUYOSHI;TAKAHASHI, MAKOTO
分类号 B65D65/40;B29C55/02;B29K23/00;B29K83/00;B29L9/00;B32B27/00;B65D65/42;(IPC1-7):B65D65/42 主分类号 B65D65/40
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