APPARATUS AND METHOD OF PROTECTING ELECTRONICS

摘要

Disclosed is an apparatus and method of protecting mass-produced electronics in harsh environments for which they were not originally designed to function. The invention provides for the electronics (16) to be encapsulated by a thermally conductive silicone compound (20), thereby forming an encapsulated electronics assembly. The encapsulated electronics assembly is placed into and retained by a protective receiver (18) that is also thermally conductive. The combination of the receiver (18) and the encapsulated electronics assembly forms a protective module (12). A number of protective modules (12) can be fastened together to form a rigid electronics package (10). The combination of the silicone compound (20) and rigid (10) package formed by the modules (12) provides protection from harsh mechanical and thermal environments.