发明名称 Spulenklebemittel
摘要 1,178,911. Polyamide compositions. PHILIPS ELECTRONIC & ASSOCIATED .INDUSTRIES Ltd. 11 Jan., 1967 [13 Jan., 1966], No. 1570/67. Heading C3R. A composition suitable for use as an adhesive in the insulating coating of wire comprises (1) at least 50% by weight of a polyamide resin having a softening range of 150‹ to 180‹ C. and a viscosity at 205‹ C. of 25 to 50 poises; (2) 5 to 40% by weight of carnauba wax; and (3) 2 to 25% by weight of colophonium. The polyamide resin is preferably a condensate of a dimerized or trimerized fatty acid and a polyamine (e.g. ethylene diamine).
申请公布号 DE1594229(A1) 申请公布日期 1969.08.21
申请号 DE19661594229 申请日期 1966.01.13
申请人 PHILIPS' PATENTVERWALTUNG GMBH 发明人 JOST,GUENTER
分类号 C08L77/00;H01B3/30;H01B3/32 主分类号 C08L77/00
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