INTEGRATED CIRCUIT HAVING A PARASITIC RESONANCE FILTER

摘要

A packaged integrated circuit configured for interconnection to an external component comprises a die (1) having an RF port, the die (1) being disposed on a lead frame (3). The lead frame (3) comprises a plurality of leads (9). At least two of the leads are first and second RF port leads (9a, 9b) which are electrically connected to the RF port. When mounted to a printed circuit board substrate, there is a capacitor (12) connected between the first and second RF port leads (9a, 9b) to achieve frequency specific signal attenuation at an unwanted frequency with minimal contribution of insertion loss at a desired frequency.