| 摘要 |
<p>The present invention relates generally to a process for metallization of composite and non-composite materials. In particular, the present invention relates to a process for film transfer metallization in which a carrier film, preferably comprised of a polymeric material, is coated with a metal layer on one side, deposited onto a substrate such that the metal layer is not in contact with the substrate, transferred directly to a component material, and then cured to consolidate and transfer the metal layer to the component material. The cured carrier film may be removed or stripped from the cured component material as desired. The component material may be a composite material or a non-composite material. With non-composite components, the process includes the step of applying an adhesive layer to the metallized carrier film. Embodiments of the process of the present invention may include the use of a pressure sensitive adhesive, and the steps of embossing or etching the carrier film with patterns, such as holographic patterns, before metallizing the carrier film. <IMAGE></p> |
