发明名称 |
Semiconductor power device |
摘要 |
A semiconductor power device comprises a metal conductor (6) coupled to a semiconductor region (30) of the device, one or more bumps (8) formed in contact with the metal conductor (6) and a frame (14) formed of high conductivity material. The frame (14) comprises a connecting portion (18) for connecting to at least one of the one or more bumps (8) so as to provide an external connection to the semiconductor region (30) of the device. <IMAGE> <IMAGE> |
申请公布号 |
EP0859414(A1) |
申请公布日期 |
1998.08.19 |
申请号 |
EP19980101266 |
申请日期 |
1998.01.26 |
申请人 |
MOTOROLA SEMICONDUCTEURS S.A. |
发明人 |
SICARD, THIERRY;MACHUGA, STEVE CHARLES;MONROE, CONRAD |
分类号 |
H01L23/52;H01L21/3205;H01L23/482;H01L25/07;H01L25/18;H01L29/417;H01L29/78 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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