发明名称 GRINDING HEIGHT POSITION SETTING METHOD FOR GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a grinding height position setting method for grinding device capable of performing correct setting by preventing damage to a grinding head when a sensor height original point to determine a grinding height position is set. SOLUTION: Before starting a grinding operation, a contact rod 10 provided with a grinding tape 8 is brought in contact with a correction table 15 so as to set a height of sensors 3a and 3b to detect the surface of the correction table 15 as a height original point. Also, because the correction table 15 is formed so that a table 16 comprising a rigid body is supported by an elastic supporting body 14, it is sunk according to a pressing force at the time of contact with the contact rod 10. As a result, the contact rod 10 is not damaged. In addition, because it is brought in contact by point contact with the top end of the contact rod 10, accurate height original point can be set.
申请公布号 JPH10217089(A) 申请公布日期 1998.08.18
申请号 JP19970016937 申请日期 1997.01.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIKAWA TORU;ISHIMARU HIDEYUKI;YASUHIRA NOBUO;UCHIDA HARUTO;KASAI KENJI
分类号 B24B49/08;B24B21/00;(IPC1-7):B24B21/00 主分类号 B24B49/08
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