Universal bond pad configuration

摘要

A thin film magnetic head includes a slider having a transducer and a plurality of bond pads disposed on an end surface of the slider. Each bond pad has a first portion configured and arranged relative to a second portion so that the first portion is substantially perpendicular to the second portion. This arrangement provides generally perpendicular surfaces on the same bond pad that are available for connection with a conductive component from a flexure assembly, which is connected to a top surface of the slider. The first portion of the bond pads has a generally vertical orientation while the second portion of the bond pads has a generally horizontal orientation.