| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid sealing resin composition capable of reducing a stress and remarkably improving heat radiating properties without deteriorating operating efficiency in chip on board sealing, etc. SOLUTION: This liquid sealing resin composition consists essentially of (A) an epoxy resin such as bisphenol A diglycidyl ether, (B) a fused silica comprising a fused silica, having 20-50μm average particle diameter and mixed with a fused silica having 0.5-1μm average particle diameter, (C) an alicyclic acid anhydride curing agent such as methyltetrahydrophthalic anhydride and (D) a curing accelerator such as an imidazole-based capsular type.
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