| 摘要 |
On a semiconductor substrate with an active layer, a first-stage recess groove is formed by photolithography and wet or dry etching. On the semiconductor substrate and the surface of the first-stage recess groove, a surface passivation film a crystalline material such as i-GaAs or an insulating film of, e.g., SiON, is formed. The surface passivation film on an area where an ohmic electrodes is to be formed is removed and the ohmic electrode is formed on the area by vapor deposition. Thereafter, in the first-stage recess groove, a second-stage recess groove is formed by photolithography and wet or dry etching. A gate electrode is formed on the second-stage recess groove by sputtering or the like.
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