Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment

摘要

A semiconductor device comprises a flexible substrate (10) having a wiring pattern (54) formed thereon; a semiconductor chip (15) mounted on the flexible substrate (10), the semiconductor chip (15) having a plurality of electrodes (21) electrically connected to the wiring pattern (54); and a plurality of external terminals (11a, 11b) electrically connected to the wiring pattern (54), the external terminals (11a, 11b) protruding on a first side of the flexible substrate (10), at least one of the external terminals (11b) provided on a peripheral portion of the flexible substrate (10) outside of a portion of the flexible substrate (10) on which the semiconductor chip (15) is mounted. A reinforcing member (23) is provided on the peripheral portion on a second side of the flexible substrate (10) opposite to the first side.