发明名称 |
Method for forming shallow junction for semiconductor device |
摘要 |
A method for forming a shallow junction of a semiconductor device using a zirconium film to cover a semiconductor substrate and implanting impurities into the zirconium film. A titanium film is then formed over the zirconium film and both the zirconium and the titanium films are subjected to a thermal treatment to form a zirconium silicide and a titanium silicide. Unreacted parts of the zirconium film and titanium film are removed and the zirconium and titanium silicides are then subject to a second thermal treatment.
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申请公布号 |
US5795808(A) |
申请公布日期 |
1998.08.18 |
申请号 |
US19960744154 |
申请日期 |
1996.11.12 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES C., LTD. |
发明人 |
PARK, BO HYUN |
分类号 |
H01L21/28;H01L21/265;H01L21/285;H01L21/314;H01L21/336;H01L29/78;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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