SEALING STRUCTURE OF ELECTRONIC PART AND SEALING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the sealing effect by embedding an electronic part mounted on a printed wiring board and forming a double sealed structure for covering the whole of the printed wiring board with an inner resin molded section having a positioning protruded section protruding outward and attached thereon. SOLUTION: Molten resin is filled in a clearance between a printed wiring board 1 and a first molding die, and various kinds of electronic parts like an electromagnetic coil 2, an IC package 4 and others are embedded thereon, and inner resin molded sections 11 having a number of positioning protruded sections 12 protruding outward and formed on the upper and lower peripheral faces are formed. A printed wiring board 1 with the inner resin molded section 11 thereon is inserted into a second molding die, and the positioning protruded sections 12 are brought into contact with the mold inner face and positioned thereon, and molten resin is filled in a clearance between the outer face of the inner resin molded section 11 and the inner face of the second molding die to form an outer resin molded section. At the time of molding, a part of resin intrudes into recessed sections 13 or the positioning protruded sections 12 are coated with resin, so a double sealed structure is provided to prevent such troubles.