METHOD AND STRUCTURE FOR PACKING ELECTRONIC PARTS,申请号JP19970019068-传众专利搜索

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发明名称	METHOD AND STRUCTURE FOR PACKING ELECTRONIC PARTS
摘要
申请公布号	JPH10218277(A)	申请公布日期	1998.08.18
申请号	JP19970019068	申请日期	1997.01.31
申请人	OKI ELECTRIC IND CO LTD	发明人	OKA MINORU
分类号	B65D73/02;B65D85/86;(IPC1-7):B65D85/86	主分类号	B65D73/02
代理机构		代理人
主权项
地址

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