| 摘要 |
A heat sink device is disclosed which provides a large surface area in order to facilitate heat transfer into the surrounding air and which also allows cooling air to impinge directly upon the integrated circuit device being cooled. The heat sink device is constructed having a relatively large central region which is adapted to contact the integrated circuit device. This large central region facilitates conduction of heat from the integrated circuit device into the heat sink device. Extending outwardly from the central region are a plurality of cooling fins which facilitate the conduction of heat out of the central region and which provide a large surface area to enhance heat transfer into the surrounding air.
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