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发明名称
POLISHING METHOD OF SILICON WAFER
摘要
申请公布号
KR0145300(B1)
申请公布日期
1998.08.17
申请号
KR19890008887
申请日期
1989.06.27
申请人
MITSUBISHI MATERIAL SILICON CO.,LTD;SONY CO.,LTD
发明人
SAITO, YUICHI;SAKAI, SINSKE;HAYASI, HISAO;MATSUSHITA, DAKESI
分类号
B24B37/04;H01L21/306;(IPC1-7):H01L21/304
主分类号
B24B37/04
代理机构
代理人
主权项
地址
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