SEMICONDUCTOR PACKAGE MOLD WITH A BUMP TYPE AIR VENT KITS,申请号KR19950004588-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE MOLD WITH A BUMP TYPE AIR VENT KITS
摘要
申请公布号	KR0142757(B1)	申请公布日期	1998.08.17
申请号	KR19950004588	申请日期	1995.03.07
申请人	SAMSUNG ELECTRONICS CO.,LTD	发明人	OH, SE-HYUK
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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